Chipmaker MediaTek has unveiled its latest 5G chipset--the Dimensity 9000, the world's first TSMC chip to be built on the 4nm process.
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The Dimensity 9000 is the first sub-6GHz 5G chipset to use a Cortex-X2 core clocked at up to 3.05GHz, and also the first in the world to feature Bluetooth 5.3 connectivity. Arranged in a 1+3+4 setup, the chip has a cluster of 3X Cortex-A710 "super cores" that are clocked at up to 2.85GHz, and a cluster of 4 efficiency Cortex A510 cores, clocked at 1.8GHz.
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While the 5G modem complies with the 3GPP Release-16 standard, and supports sub-GHz 5G, there's no mmWave 5G on the Dimensity 9000. MediaTek also claims the modem brings improved power consumption for both active and standby 5G connections.
The Dimensity 9000 will support LPDDR5x RAM speeds of up to 7500Mbps in smartphones, and gets 14MB of cache, which MediaTek claims improves performance by 7% and bandwidth consumption by 25% compared to just 8MB of cache.
In the graphics department, the Dimensity 9000 gets a new 10-core Mali-G710 GPU, along with a new raytracing SDK for developers to be able to add new visual improvements.
The Image Signal Processor on the Dimensity 9000 can capture 4K HDR video for three cameras simultaneously, which MediaTek says will allow devices to capture three exposures at once. Moreover, the chipset will support camera sensors of up to 320-megapixels.
MediaTek has says the first smartphones to use the Dimensity 9000 chipset will begin arriving globally in late Q1 2022.