Chipset maker MediaTek, which recently announced the new flagship Dimensity 9000 chipset, is also working on a new upper mid-range chipset called the MediaTek Dimensity 7000. A tipster on Chinese social media network Weibo has indicated that the upcoming MediaTek Dimensity 7000 chipset has entered the testing phase.
The MediaTek Dimensity 7000 is also reportedly based on TSMC’s 5nm manufacturing process, and also uses ARM’s V9 architecture, which was used in the Dimensity 9000 chipset.
According to sources, the chipset should slot in between the Snapdragon 870 and Snapdragon 888 in terms of performance, with a 75W TDP.
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The MediaTek Dimensity 9000 SoC, which has recently been launched, is the first sub-6GHz 5G chipset to use a Cortex-X2 core clocked at up to 3.05GHz, and also the first in the world to feature Bluetooth 5.3 connectivity. Arranged in a 1+3+4 setup, the chip has a cluster of 3X Cortex-A710 ‘super cores’ that are clocked at up to 2.85GHz, and a cluster of 4 efficiency Cortex A510 cores, clocked at 1.8GHz.
The Dimensity 9000 will support LPDDR5x RAM speeds of up to 7500Mbps in smartphones, and gets 14MB of cache, which MediaTek claims improves performance by 7% and bandwidth consumption by 25% compared to just 8MB of cache.
MediaTek says the first smartphones to use the Dimensity 9000 chipset will begin arriving globally in late Q1 2022.